I'm a little confused about gold plating as a solderable finish for circuit
boards and was wondering if anyone can clarify a few points.

        Most of our PCB's are have a hot air solder level finish, but finer pitches
and smaller parts are requiring us to look at boards with flatter surfaces
and it looks like Nickel-Gold finishes have become somewhat popular.

        From what I understand, gold can be applied electrolyticly, electroless
plating, or by immersion.  (I don't really understand the difference between
electroless and immersion).  Is any one method superior to the others?  It
seems like immersion leaves the thinnest amount of gold.  Does immersion
leave the flattest surface as well?

        Furthermore it appears that you can get hard and soft gold, at least with
an electrolytic process.  Is one better than the other?

        I appreciate any help.

Mark Rusciolelli
Nexus Custom Electronics

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