We are a small, primarily captive, board assembly house that recently
brought our outsourced SMT assemblies in-house. We rely heavily on IPC
documentation in developing our acceptance criteria for Class 2 assemblies.
Have run into a problem with the idea of side joint length vs. end joint
width. Section 12.2.5.4 of  610C states that the minimum side joint length
is equal to the lead width or 75% of the lead length, whichever is less. I
would interpret this to mean that an acceptable solder joint does not
necessarily have to reach the toe of the component. However the preceding
section, end joint width-12.2.5.3, seems to indicate that not only does
solder need to contact the toe, it must also extend along 50% of the width
of the toe. Is there a conflict or am I not interpreting the spec correctly?
Thanks for your help.

Tom Moore
Quality Assurance Manager
Electro Plasma, Inc.
PH   419-255-5197
FAX  419-838-6745

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