Imm tin at 44 micron!!!  Wow, that seems very thick.  We expect minimum
thickness of 0.65 microns with a maximum thickness of 1.5 microns.

Dave Fish
----- Original Message -----
From: "Tuan Bui" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 26, 2002 11:05 AM
Subject: Re: [TN] Immersion Gold Vs Immersion Tin for 0201 landpatterns


> Hi George,
>
> The Immersion Gold process that the PCB vendor stated that the Immersion
> gold (7-10 micron) over nickel over copper. The Immersion Tin process, as
> you have mentioned, is about 44 micron.  It is good to hear that the
> immersion tin process can be easily/inexpensive reworked when its shelf
> live expires.
>
> BTW, thanks for your input.
>
> Tuan Bui
> Proc Dev Eng
> Conexant Systems Inc.
>
>
>
>                       George Milad
>                       <[log in to unmask]>         To:       [log in to unmask]
>                       Sent by: TechNet         cc:
>                       <[log in to unmask]>        Subject:  Re: [TN]
Immersion Gold Vs Immersion Tin for 0201 landpatterns
>
>
>                       04/26/2002 08:47
>                       AM
>                       Please respond to
>                       "TechNet E-Mail
>                       Forum."; Please
>                       respond to Gmilad
>
>
>
>
>
>
> Tuan,
> Could you clarify the "Immersion Gold" process that you are using. Is it
> Immersion gold over copper or it immersion gold over nickel over copper?
>
> Immersion Tin is a viable alternative for your application. However the
> thickness required will much higher than the 7 - 8 uins that you are
> presently using for  gold, more like 30 - 40 uins. Tin is realtive
> inexpensive and can be easily reworked if shelf life becomes an issue.
>
> George Milad
> HDI Consulting
> Chairman IPC Plating Committee.
>
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