Hi George,

The Immersion Gold process that the PCB vendor stated that the Immersion
gold (7-10 micron) over nickel over copper. The Immersion Tin process, as
you have mentioned, is about 44 micron.  It is good to hear that the
immersion tin process can be easily/inexpensive reworked when its shelf
live expires.

BTW, thanks for your input.

Tuan Bui
Proc Dev Eng
Conexant Systems Inc.



                      George Milad
                      <[log in to unmask]>         To:       [log in to unmask]
                      Sent by: TechNet         cc:
                      <[log in to unmask]>        Subject:  Re: [TN] Immersion Gold Vs Immersion Tin for 0201 landpatterns


                      04/26/2002 08:47
                      AM
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                      "TechNet E-Mail
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                      respond to Gmilad






Tuan,
Could you clarify the "Immersion Gold" process that you are using. Is it
Immersion gold over copper or it immersion gold over nickel over copper?

Immersion Tin is a viable alternative for your application. However the
thickness required will much higher than the 7 - 8 uins that you are
presently using for  gold, more like 30 - 40 uins. Tin is realtive
inexpensive and can be easily reworked if shelf life becomes an issue.

George Milad
HDI Consulting
Chairman IPC Plating Committee.

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