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April 2002

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Apr 2002 07:10:02 -0400
Content-Type:
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John, We've looked into the sand thing a while ago, and found that just by
increasing the copper plating in the hole to 2 mils will give you far better
thermal performance than any thermally conductive epoxy for hole fill.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   John Foster [SMTP:[log in to unmask]]
        Sent:   Tuesday, April 23, 2002 3:07 PM
        To:     [log in to unmask]
        Subject:        [TN] Via Plug

        Hello, I am new to this listserver. I must say that it is very
        informative. I wish I had known of it long ago.

        I have a question about via plugging.  Right now
        our board vendor is doing our via plugs with
        I guess with a standard epoxy. We are trying
        to find a solution that would give us a much
        better thermal performance.

        We are looking at silver epoxy and this
        material from Dupont.  Does anyone know of
        some material that would give us a really good
        thermal performance. We are in a commercial
        environment. So the material does not have to
        meet industrial specs.

        Any input on this matter would be greatly '
        appreciated.

        Thank You

        John Foster


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