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April 2002

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Subject:
From:
Lou Hart <[log in to unmask]>
Reply To:
Date:
Mon, 1 Apr 2002 21:59:44 -0500
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Valquirio, you've noted an important issue before beginning your
experiment:  what is the measure of performance?  The uncertainty (quality)
of the measurement will affect something that you haven't mentioned:  the
number of replications of each element in the L9 array.  Lou Hart

-----Original Message-----
From:   Valquirio N. Carvalho [SMTP:[log in to unmask]]
Sent:   Monday, April 01, 2002 8:42 PM
To:     [log in to unmask]
Subject:        [TN] Indium Solder

Hello Technetters:

I'm trying to develop and optimize a process for the following:

   SMT part where the bottom of the device (gold over nickel) will be
   soldered to a gold-plated copper surface (50-150 uin Ni, 3-8 uin Au)
below
   the top of the board surface.

   The copper surface is actually a "coin".  The pcb is milled from the
   bottom-side to a specific ground plane.  The coin is then hi-temp
   soldered (Sn95Sb) to the ground plane layer (this is done at the board
   fab. shop).

   The manufacturer of the smt part recommends a pure indium foil .25" x
.25",
   .003" thick.

   The component also has about thirteen gull-wing leads that depending on
the
   tolerance stack-up, may be reflow soldered or hand soldered.

We're going to run three replications of an L9 DoE (four factors, three
levels) to develop and optimize the process.

So, several questions:

   Where I'm soldering two gold surfaces, and low-temp is recommended, is
   indium the best choice?

   Any suggestions on how to evaluate the results of the DoE?  X-Ray,
   cross-sections, pull-tests, cleanliness?

Thanks for any input,

Valquirio N. Carvalho

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