We build mostly high end RF circuit boards and are faced with component
land patterns that the IPC standards do not address.

Our rule of thumb is the exact opposite of what I have seen most of you
concur on, and that is, we use the manufacturers data sheet first, until we
find that it does not work.  Very rarely do we have to change the land
patterns.  And then it is primarily only when the circuit is not performing
adequately.

We also sell our chip set and therefore do a lot of work to prepare a
documented and well proven package for the customers.  There is a lot to be
said for following the instructions that a supplier gives you when it comes
to custom components such as BCCs and duplexors.

I just don't want everyone to assume that the suppliers data sheets are
always junk.   But I do wish that the customers would provide feedback
especially if they find a land pattern that works even better.

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