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April 2002

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From:
Seth Goodman <[log in to unmask]>
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Date:
Wed, 3 Apr 2002 22:42:23 -0600
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Hi Steve,

Could you copy me on those reports as well?  I specify this finish quite
often (though I don't mention the brand name, just SMOBC followed by
immersion white tin 35 microinches minimum over exposed copper).  I have
been in the habit of including test points and non-tented vias in the solder
paste films, though I have no data to back up this practice.  Just a
personal suspicion that this makes it more robust.  It would be nice to know
if this was helpful or just a waste of solder.

Regards,

Seth Goodman
Goodman Associates, LLC
tel 608.833.9933
fax 608.833.9966


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Kelly
Sent: Wednesday, April 03, 2002 9:26 AM
To: [log in to unmask]
Subject: Re: [TN] Tin whiskers and immersion tin coatings


I have a bunch of information I can send you if you want - tests done by
Omikron and others. Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Tuesday, April 02, 2002 6:40 PM
To: [log in to unmask]
Subject: [TN] Tin whiskers and immersion tin coatings


Technetters,
To a certain extent I am aware of the work the NEMI tin whisker task force
and various connector/component manufacturers are doing about 100% tin
coatings.  But I am still left with several questions whose answers I have
missed or questions that have not been addressed.  So... here goes - the
immersion tin coating are for SMT pads that are going to be soldered.  What
are people doing about test points? Are there stencil openings to put solder
on these pads as well?  Or are these pads left unsoldered?  Has anyone
carried out any testing with regards to the tendency of these materials to
grow/not grow whiskers? Or do the organics in the coating completely kill
that possibility?

regards,
Bev Christian
Research in Motion

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