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April 2002

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Subject:
From:
Mel Parrish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Apr 2002 09:15:31 -0500
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Scott,
The content of 610 regarding silver plate wire is one of those dinosaurs
that is left over from the 70s and that originated in the very early Mil
Specs or maybe even NHB. You will not even find a reference in MIL-STD-2000
to restrict silver.
Contract documents and BOM commonly reference silver wire for production and
the justification as I recall was improved shelf life and solderability.
Additionally silver plate wire achieved preferred performance in
solderability testing after steam aging required under 202.
I'm sure there was a justification originally for the restriction but it was
before my time and that is saying sumpin.


Mel Parrish
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]
www.solderingtech.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott Kauling
Sent: Thursday, April 18, 2002 5:15 PM
To: [log in to unmask]
Subject: [TN] Silver


With all of the discussion about the immersion silver, I have a few
questions.

Why can you not use silver jumper wire per IPC-A-610, but it is OK to use
it for a board finish?

I was given a sample of a conductive pen to try as an alternate for jumper
wires and it contains silver.  Is anyone using a product such as this on
production boards or is this something that should be kept in the
engineering lab as products are being developed?

I am sure that you folks will clear up my confusion.

SCOTT

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