Ken,
Here are some references that may help you,

http://www.protoengineering.com/pdf/viaplug.pdf
http://www.circuitree.com/CDA/ArticleInformation/features/BNP__Features__Ite
m/0,2133,72451,00.html
http://www.ammagazine.com/CDA/ArticleInformation/features/BNP__Features__Ite
m/0,2606,5918,00.html
http://www.asat.com/AdditionalInfo/tg1004.pdf
http://extra.ivf.se/ngl/F-MCM/ChapterF2.htm
http://www.ece.gatech.edu/research/labs/gsigroup/publications/chirag_imaps.p
df

 Regards,

 Shahed



-----Original Message-----
From: Ken Patel [mailto:[log in to unmask]]
Sent: Thursday, April 18, 2002 6:21 PM
To: [log in to unmask]
Subject: [TN] Via in Pad: Filling of vias using silver epoxy!?!?


Guys,
I am dealing with high frequency board which is 25 mil thick and made of
Rogers material. The other side is totally exposed copper. How should I
handle as there via in pads (VIP)? I have heard about filling the vias
using silver epoxy and then plating it over. Can someone shed some more
light?

re,
ken patel

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