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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 1 Apr 2002 20:41:40 -0500 |
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Hello Technetters:
I'm trying to develop and optimize a process for the following:
SMT part where the bottom of the device (gold over nickel) will be
soldered to a gold-plated copper surface (50-150 uin Ni, 3-8 uin Au) below
the top of the board surface.
The copper surface is actually a "coin". The pcb is milled from the
bottom-side to a specific ground plane. The coin is then hi-temp
soldered (Sn95Sb) to the ground plane layer (this is done at the board
fab. shop).
The manufacturer of the smt part recommends a pure indium foil .25" x .25",
.003" thick.
The component also has about thirteen gull-wing leads that depending on the
tolerance stack-up, may be reflow soldered or hand soldered.
We're going to run three replications of an L9 DoE (four factors, three
levels) to develop and optimize the process.
So, several questions:
Where I'm soldering two gold surfaces, and low-temp is recommended, is
indium the best choice?
Any suggestions on how to evaluate the results of the DoE? X-Ray,
cross-sections, pull-tests, cleanliness?
Thanks for any input,
Valquirio N. Carvalho
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