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April 2002

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Subject:
From:
"Valquirio N. Carvalho" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 1 Apr 2002 20:41:40 -0500
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Hello Technetters:

I'm trying to develop and optimize a process for the following:

   SMT part where the bottom of the device (gold over nickel) will be
   soldered to a gold-plated copper surface (50-150 uin Ni, 3-8 uin Au) below
   the top of the board surface.

   The copper surface is actually a "coin".  The pcb is milled from the
   bottom-side to a specific ground plane.  The coin is then hi-temp
   soldered (Sn95Sb) to the ground plane layer (this is done at the board
   fab. shop).

   The manufacturer of the smt part recommends a pure indium foil .25" x .25",
   .003" thick.

   The component also has about thirteen gull-wing leads that depending on the
   tolerance stack-up, may be reflow soldered or hand soldered.

We're going to run three replications of an L9 DoE (four factors, three
levels) to develop and optimize the process.

So, several questions:

   Where I'm soldering two gold surfaces, and low-temp is recommended, is
   indium the best choice?

   Any suggestions on how to evaluate the results of the DoE?  X-Ray,
   cross-sections, pull-tests, cleanliness?

Thanks for any input,

Valquirio N. Carvalho

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