This problem is never ending. I'm working now on the ugliest R/F board
imagineable. It too has all your problems. However, I have a forward
thinking engineer who understands the issues involved as you state them. We
are redesigning and he's recalculating to eliminate those issues. So, it can
be done. No, unless you redesign, you have a lost cause notwighstanding
rework adn subsequentg chip cracking due to thermal issues related trying to
solder the little mutha's.

You can add vias in pads only as micro types or those having been plugged
and plated over. Still a redesign exists.

On the same note, can someone recommend a good R/F and other electrical
performance tool that is relatively easy to use? Hell of a question I know,
but consider the source.

MoonMan

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