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April 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 Apr 2002 11:03:09 -0500
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Very ggod question for naive Dan

I use a ratio thst has some validity though results vary with process
management and requirements as well as the process itself. If I specify one
mil of copper plating in a typical hole wall, whatever that is now, I expect
to verify about 1.2 mils on the board surface. So, if I start with .5 oz. Cu
folil on the board outer layers, I will see about 1.9 mils total for traces,
as an example, on the surface. There's some math in there somewhere and Rudy
probably will provide the real answer.

Earl

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