To TechNet,

Wondering if there is a specifcation to indicate the limit of ionic
contamination for an after reflow boards. Understand that the amount of the
flux activator remain on the boards is depending on the amount of solder
joints on the boards. So, is there a criteria to address the amount of
ionic versus the pads area or other related criterias?

We are currently having corrosion on the board (after 1 year of application
in the field). The flux we are using are no clean RMA flux.  After
extracted the flux remnant from the boards and subjected for Capillary
Electrophoresis (CE-MS) test, we found high amount of bromide, chloride,
nitrite and nitrate. I am not sure if thease are the elements that caused
the corrosion.

From here, I am not sure if it is practical to specify the ionic limit on
the after reflow boards? Or should continue to work on the driven factor of
the corrosion like water, voltage, electromigration etc?

Appreciate any inputs.

Best Regards,
YH Koh

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