1. Can I build a 20 layer PWB that does not exceed 0.125 overall thickness
and still have 2 oz Cu that still meets IPC class 3?  I have some concern
about controlled impedance and the need for inner layers being thick enough
to meet product objective.

2. Have any of you pursued the DoD  "Single Process Initiative" (SPI)
process, often referred to as a "Block Change", which lets military
contractors file a single document with DoD stating that they will use one
standard (usually J-STD-001) for all their soldering requirements.  I'd like
to discuss how it went and whether there were any special hoops you had to
jump through.

TechNet participants from  Boeing, DoD,  Raytheon, Lockheed-Martin,
Northrop-Grumman, Bechtel Plant Machinery, BAE, L-3 Communications, AAI or
others are especially invited to respond.

Mike Weekes
[log in to unmask]












 Boeing and DoD have contracts with many companies that work to IPC
standards. Boeing themselves, also Raytheon, Lockheed-Martin,
Northrop-Grumman, Bechtel Plant Machinery, BAE, L-3 Communications, AAI to
name just a few.

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