Sounds like a good plan. I have seen problems with canned libraries (The
kind that are third party add-on). Usually they are okay but . . .
I have seen bad advice from component suppliers. But, I have never had a
problem when a pattern did conform to IPC guidelines. The land pattern
calculator does include provision for solder fillet characteristics (heel
fillet height, side joint length and so on).
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon
> Sent: Monday, April 15, 2002 12:29 PM
> To: [log in to unmask]
> Subject: Re: [TN] IPC SMT FOOTPRINT DESIGN GUIDLINES VS SUPPLIERS
>
>
> Jeff,
>
> Appreciate you time, input, and empathy. This story certainly is
> not new but
> keeps getting more interesting and complex with time.
>
> I'm held accountable by my CM's if the solder joints do not meet IPC
> requirements. Ok, but I'm not able to directly correlate design guidelines
> with acceptance criteria in IPC requirement - not guidelines
> especially now
> that DoD has adopted and, essentially, validated the specifications - not
> guidelines.
>
> Werner serves as chair on three committees and co chair on some more, I
> guess. The committees are composed of leaders in our industry
> putting forth
> great stuff as I said before concerning design for reliability.
>
> Component suppliers make up their rules as well. All I'm saying
> is there is
> a gap and it seems to be getting wider especially for one or two man/woman
> design teams tempted to go whichever way the wind blows whem enticed on a
> particlular day.
>
> Granted, there is much "slop" for forgiving designs, and the boards,
> components, and assemblies representing them. However, with
> things going in
> the obvious direction, as smaller/denser, something needs more
> attention and
> less emotion as your greatly accepted empathy. Still, for my young design
> team, I'm going all the way with IPC until proven wrong, or not.
>
> Earl
>
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