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April 2002

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Subject:
From:
Matt Kehoe <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Apr 2002 05:48:11 -0500
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On Mon, 8 Apr 2002 05:32:36 -0500, Gary Camac <[log in to unmask]> wrote:

>Steve,
>
>I would bet you can't feed these on a destacker.  What's is the category
of
>flux being used?  It is applied on the entire board surface or just at the
>soldering locations?
>
>Gary
>
>Gary
>----- Original Message -----
>From: <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Friday, April 05, 2002 6:33 PM
>Subject: [TN] Any SIPAD users?
>
>
>> Hi All!
>>
>> I got a few sample boards that a solid solder deposit was applied
(SIPAD),
>> along with what they call adhesive flux, to play around with. I got some
>> dummy components and placed and reflowed them...I was very pleased with
>the
>> results!
>>
>> Do any of you use this technology? Any thoughts or opinions would be
>> appreciated.
>>
>> Thanks!!
>>
>> -Steve Gregory-
>>
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The flux is printed onto the smd pads only using the same stencil as the
paste.

mk

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