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April 2002

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Apr 2002 18:40:04 -0500
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Technetters,
To a certain extent I am aware of the work the NEMI tin whisker task force
and various connector/component manufacturers are doing about 100% tin
coatings.  But I am still left with several questions whose answers I have
missed or questions that have not been addressed.  So... here goes - the
immersion tin coating are for SMT pads that are going to be soldered.  What
are people doing about test points? Are there stencil openings to put solder
on these pads as well?  Or are these pads left unsoldered?  Has anyone
carried out any testing with regards to the tendency of these materials to
grow/not grow whiskers? Or do the organics in the coating completely kill
that possibility?

regards,
Bev Christian
Research in Motion

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