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April 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Apr 2002 12:40:27 -0500
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I'm no expert on this or anything else for that matter, but I've changed all
my 0603 pads to rather convential 0402 pads based on an "old" HP study. I
like everything everyone has said. I even like round pads for chips so they
"self" align and, for sure, BGA's for paste release characteristice but
SMQ92J solved that problem - for me. I just don't want poor solder joints.

Whatever happened to home plate pads? I use them for 0402's still.

I don't use HASL on anything anymore so that problem is removed. Also, I try
very hard to eliminate component solderability issues before they occur.
Solderability testing, you know?. That one is difficult at times and don't
even know if it's getting better.

I do still xray from time to time even on chips and leaded devices. It
provides some evidence about how well flux is doing its job relative to
removing oxidation. If it doesn't work well, or if oxidation is excessive,
it can't do its job so voiding is apparent. Having said that, an old can of
workms is opened but this stuff should be vanquished.

MoonMan

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