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April 2002

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Subject:
From:
"Randy Bock Sr." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Apr 2002 10:41:27 -0400
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Several possible reasons.  Contamination, cold solder for a start.  May also
be flux related.

Randy Bock Sr.
Quality Manager
Bryce Office Systems LLC
email  [log in to unmask]


----- Original Message -----
From: Antonio Souza <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, April 10, 2002 8:25 AM
Subject: [TN] Voids on BGA


> Does anybody know the main causes for Voids on BGA solder joints?
>
> Thanks
>
> Antonio
> Brazil
>
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