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April 2002

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Subject:
Re: Voids on BGA
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Apr 2002 16:02:41 +0200
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text/plain (42 lines) 
Hi Antonio,

There might be a problem with the soldering profile, but the most common cause is probably the via's in the BGA's pads, even if the via's are filled and overplated after they're drilled .
If you have a look through the Technet archives of November last year (http://jefry.ipc.org/archives/technet.html) you'll find an interesting thread about this issue. 

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net


>>> Antonio Souza <[log in to unmask]> 04/10 2:25 pm >>>
Does anybody know the main causes for Voids on BGA solder joints?

Thanks

Antonio
Brazil

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