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April 2002

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Subject:
From:
"Randy Bock Sr." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Apr 2002 07:37:51 -0400
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I guess my first question is why are you mounting the BGA  a flex circuit ??
The potential for fractures due to lack of a strain relief is HUGH.  Really
need a solid surface to mount the BGA to.

Randy Bock Sr.
Quality Manage
Bryce Office Systems LLC
email [log in to unmask]


----- Original Message -----
From: Alfson, Geordie (STP) <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, April 09, 2002 3:50 PM
Subject: [TN] BGA flex circuit failure


> Greetings,
>
> I work as a test engineer for a medical device maker. I found this forum
by
> way of the Circuits Assembly web site.
>
> My area of concern, as a test engineer, is the probing of test pads on
> flexible double sided PCA's, especially when test pads are located on the
> opposite side of a BGA. I am concerned that the probing force may result
in
> 1)solder joint fracture 2) de-lamination of the PCA 3) dislodgement of
> components, just to name a few.
>
> Do you know of any research (published papers) or colleagues with
knowledge
> in this area of flex circuits that can assist me. I want to establish test
> pin density and force limits and board layout criteria so I (hopefully)
can
> prevent PCA failure at the testing phase.
>
> Thank you
>
> Geordie Alfson
> [log in to unmask]
> Test Fixture Mechanical Engineer
> Guidant Corp
> Tel 651-582-7635  Fax 651-582-7599
>
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