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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 10 Apr 2002 10:29:37 +0200 |
Content-Type: | text/plain |
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Good Morning TechNetters,
thank you for the helpful and informative replies, especially to Graham
Naisbitt and Michael Simms for giving directions.
Volkmar
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DRÄGER ELECTRONICS
Draeger Electronics GmbH
Moislinger Allee 53-55
D-23558 Lübeck
Tel: +49-451-882-3998
Fax: +49-451-882-4365
mailto:[log in to unmask]
Website http://www.draeger.com/de/EL
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Volkmar Huss wrote:
> Hi TechNetters,
>
> we are working on defining our "No Clean" soldering process. The
> solder-paste and flux manufacturers certify the "No Clean" capability of
>
> their products to some extend, but what is the definition of "No Clean"?
>
> And I don't mean the statement, that only inert residues of flux and
> solder-paste additives remain on the board.
> Are there any standards that can used as a reference?
> How do you measure the:
> "No Clean" capability of solder paste, flux and tubular solder with flux
>
> core?
> "No Clean" quality of printed board assemblies?
> "No Clean" quality of printed board assemblies onto which devices have
> been hand-soldered?
> and all of this for prototype and series production?
>
> I have gleaned some insights from the TechNet archives, but any
> additional input is very welcome.
>
>
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