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April 2002

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Subject:
From:
Volkmar Huss <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Apr 2002 10:29:37 +0200
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Good Morning TechNetters,



thank you for the helpful and informative replies, especially to Graham

Naisbitt and Michael Simms for giving directions.





  Volkmar





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  DRÄGER ELECTRONICS



  Draeger Electronics GmbH

  Moislinger Allee 53-55

  D-23558 Lübeck



  Tel:   +49-451-882-3998

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  Website http://www.draeger.com/de/EL

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Volkmar Huss wrote:



> Hi TechNetters,

>

> we are working on defining our "No Clean" soldering process. The

> solder-paste and flux manufacturers certify the "No Clean" capability of

>

> their products to some extend, but what is the definition of "No Clean"?

>

> And I don't mean the statement, that only inert residues of flux and

> solder-paste additives remain on the board.

> Are there any standards that can used as a reference?

> How do you measure the:

> "No Clean" capability of solder paste, flux and tubular solder with flux

>

> core?

> "No Clean" quality of printed board assemblies?

> "No Clean" quality of printed board assemblies onto which devices have

> been hand-soldered?

>   and all of this for prototype and series production?

>

> I have gleaned some insights from the TechNet archives, but any

> additional input is very welcome.

>

>










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