Hi, Mary,
The tests types and levels you use have to be designed to reflect what the
product will meet in operation, as you know. I am concerned about one of
your questions, though - "Which is more efficient [at detecting solder
joint related failures]?"
My immediate impression was that you're trying to induce solder joint
failures rather than weed out weak joints. Vibration failure modes are
different from Thermal failure modes, so you can't do more of one test and
less of the other to prove whether or not solder joints are reliable. If
the product is to operate in a particular environment, which includes
vibration and temperature cycling, then you have to do both tests in
appropriate proportions and to appropriate levels.
Remember, you're trying to get your product to pass tests that prove them
suitable for their work. You're not trying to determine the conditions that
will break your product.
The sequence in which you conduct the tests is also important, especially
if you cannot conduct them concurrently as in a thermal cycling chamber
with built-in vibration table.
I will have to leave it to others to suggest how to correlate tests and
test results with operational conditions and working life, and that's not
in my knowledge base yet.
Peter
Mary Lin
<mary2001@ROA To: [log in to unmask]
DFLY.ORG> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
Sent by: Aero/ST Group)
TechNet Subject: [TN] test method to detect solder
<[log in to unmask] joint weakness
ORG>
04/10/02
12:53 AM
Please
respond to
"TechNet
E-Mail
Forum.";
Please
respond to
Mary Lin
Hello-
As we know both thermal cycling test and RS vibration test in HALT (Highly
Accerlated Life Test) are effective in detecting solder joint related
failures.
Right now we are in the process of developing HASS profile, can someone
help
me on fllowing questions?
(1)Which test is more efficient, thermal cycling or RS Vibration?
(2) how to correlate number of cycles of test (either thermal cycling or
vibration) with service time in the field application?
Thanks for your time.
Mary
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