Greetings,

I work as a test engineer for a medical device maker. I found this forum by
way of the Circuits Assembly web site.

My area of concern, as a test engineer, is the probing of test pads on
flexible double sided PCA's, especially when test pads are located on the
opposite side of a BGA. I am concerned that the probing force may result in
1)solder joint fracture 2) de-lamination of the PCA 3) dislodgement of
components, just to name a few.

Do you know of any research (published papers) or colleagues with knowledge
in this area of flex circuits that can assist me. I want to establish test
pin density and force limits and board layout criteria so I (hopefully) can
prevent PCA failure at the testing phase.

Thank you

Geordie Alfson
[log in to unmask]
Test Fixture Mechanical Engineer
Guidant Corp
Tel 651-582-7635  Fax 651-582-7599

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