Like most engineering answers.  It depends.

I would be more inclined to use vibration if the product will be subjected
to vibration in the field.  Same goes for temperature.  Also it depends on
the product.  If you have a board of high-profile, massive components, then
vibration might be a good choice.  But, if your product has an unreliable
manufacturing process with only SMT components then temperature cycling
might be the best bet.  Also, the chamber should be able to cause the
thermal rates of change necessary to cause the stress necessary to induce
the failures.

Just some things to think about.

Good Luck

-----Original Message-----
From:   Mary Lin [mailto:[log in to unmask]]
Sent:   Tuesday, April 09, 2002 10:53 AM
To:     [log in to unmask]
Subject:        [TN] test method to detect solder joint weakness

Hello-

As we know both thermal cycling test and RS vibration test in HALT (Highly
Accerlated Life Test) are effective in detecting solder joint related
failures.
Right now we are in the process of developing HASS profile, can someone help
me on fllowing questions?

(1)Which test is more efficient, thermal cycling or RS Vibration?
(2) how to correlate number of cycles of test (either thermal cycling or
vibration) with service time in the field application?

Thanks for your time.

Mary
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