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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 5 Apr 2002 12:59:27 -0500 |
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How do you do it?
RL
----- Original Message -----
From: "Safavi-Bayat Shahed" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 05, 2002 9:57 AM
Subject: Re: [TN] Via in Pad
> I used vias in pads on many RF boards and had NO problem
> what so ever. It amuses me a lot, to see these much discussions are going
on
>
> about this "issue".
>
> Shahed
>
>
>
>
>
>
>
> -----Original Message-----
> From: Bartkowaik Christine [mailto:[log in to unmask]]
> Sent: Friday, April 05, 2002 8:54 AM
> To: [log in to unmask]
> Subject: [TN] Via in Pad
>
>
> Via In Pad's:
> Our R&D group wants to place via's in pads (In the past I have asked them
> NOT to due this).
> Does anyone have success with placing via's in pads based on some known
> Guidelines?
>
> Thanks, Chris
>
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Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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