DESIGNERCOUNCIL Archives

April 2002

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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Mon, 29 Apr 2002 13:00:17 -0400
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William Gilman <[log in to unmask]>
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Chris,

Sounds like you're calculating by starting with 2 oz and plating on top of
that for your thickness calculation.  I thought you were designating a 2 oz
final plating thickness...which would end up at .0028".

To your original question, have you looked at what your plating quantities
would place in your through holes for wall thickness and current carrying at
those locations?  If you need 1.5 mils wall thickness in your vias, you
might want to specify 1/2 oz Cu plated to 2 oz...or you might just specify
.0015 wall thickness on plated through holes, and let your board house
figure out how to get there.

'Course, I could just be somewhere out in left field.

William W. Gilman, CID
2827 Valley View Dr.
Knoxville, TN 37917
ph. 865-524-8679
fax 865-524-8679
cell 865-368-0665
email [log in to unmask]

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of
[log in to unmask]
Sent: Monday, April 29, 2002 12:09 PM
To: [log in to unmask]
Subject: Re: [DC] Clarification of Conductor Thickness Spec

Rodney-
That's kinda my point.

base 2oz.=.0028... plating=.001... so base of 2oz. + min avg. plating
=.0038, or 0.0965MM.

But IPC spec says min thickness for 2oz base AFTER plating=76uM (0.076mm).

But thanks for the response...
-Chris

========
Chris,
Check your conversion numbers, 2oz copper should be .0028" or .003" rounded
up.
Rodney



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