Hello to all

We have to redesign different board's because of Via in Pad:
Situation now:
FR4, thickness 1,5 mm, OCC finish
Through Hole Vias in Pads (middle, diameter 0,15..0,3 mm)

The problem is the sucking of solder form to the top to the bottom side
(causing low solder on top and bumps on test points on the bottom side)
Because of place limitations dog bones can't probably not be used.

What is your recommendation?
Using Blind Vias (problem of Voids in the solder joint?) ?
Epoxy (with Ag or what else) filled Vias?
Vias on the edge of the pad?
More ideas?

All input is welcome

Best regards

Siggi


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Kind regards / Mit freundlichen Grüßen

Dr. Siegmund Zweigart

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