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Reply To: | TechNet E-Mail Forum. |
Date: | Sat, 30 Mar 2002 10:07:31 +0800 |
Content-Type: | text/plain |
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Hi Volkmar:
IPC-TP-1115 "selection and implementation strategy for A Low-Residue N0 clean Process"has details.
----- Original Message -----
From: "Volkmar Huss" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, March 26, 2002 10:36 PM
Subject: [TN] Measuring "No Clean" process quality
> Hi TechNetters,
>
> we are working on defining our "No Clean" soldering process. The
> solder-paste and flux manufacturers certify the "No Clean" capability of
>
> their products to some extend, but what is the definition of "No Clean"?
>
> And I don't mean the statement, that only inert residues of flux and
> solder-paste additives remain on the board.
> Are there any standards that can used as a reference?
> How do you measure the:
> "No Clean" capability of solder paste, flux and tubular solder with flux
>
> core?
> "No Clean" quality of printed board assemblies?
> "No Clean" quality of printed board assemblies onto which devices have
> been hand-soldered?
> and all of this for prototype and series production?
>
> I have gleaned some insights from the TechNet archives, but any
> additional input is very welcome.
>
> Best regards
>
> Volkmar Hu
>
> Engineering Electronic Circuit Boards
> Aufbau- und Verbindungstechnik
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> DRGER ELECTRONICS
>
> Draeger Electronics GmbH
> Moislinger Allee 53-55
> D-23558 Lbeck
>
> Tel: +49-451-882-3998
> Fax: +49-451-882-4365
> mailto:[log in to unmask]
> Website http://www.draeger.com/de/EL
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> --
> Best regards / Mit freundlichen Gren
>
> Volkmar Hu
>
> Engineering Electronic Circuit Boards
> Aufbau- und Verbindungstechnik
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> DRGER ELECTRONICS
>
> Draeger Electronics GmbH
> Moislinger Allee 53-55
> D-23558 Lbeck
>
> Tel: +49-451-882-3998
> Fax: +49-451-882-4365
> mailto:[log in to unmask]
> Website http://www.draeger.com/de/EL
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
>
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