We have a lot of BGA packages from a custom package house with a "wrinkled" appearance to the ball surface, most pronounced on top of the ball, where they will interface with the PCB.  These packages are prone to shorting.

Does anyone out there have an idea of what might cause that "wrinkled" appearance, and why it might make the package succeptible to shorting?


Larry Jindra
Mfg Engr Group Lead
TRW Radio Systems
[log in to unmask]
w) 858-592-3424
f)  858-592-3940

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