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Subject:	Re: solder paste registration
From:	tony steinke <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 29 Mar 2002 12:15:04 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)

Hey Folks,
The solder paste is being applied with a stencil. Thanks for all the info.
Tony steinke
----- Original Message -----
From: Brian Ellis <[log in to unmask]>
To: TechNet E-Mail Forum. <[log in to unmask]>; tony steinke
<[log in to unmask]>
Sent: Friday, March 29, 2002 9:01 AM
Subject: Re: [TN] solder paste registration


> Tony
>
> You don't say what type of screen is being used. If it's a
> nylon/polyester one, then I'd say you're in deep trouble. If it's a
> stainless steel one, it can still stretch as the squeegee distorts it.
> You really should use a stencil.
>
> Brian
>
> > tony steinke wrote:
> >
> > Ladies and Gentlemen,
> >
> > We are having a major problem with an assembly house with registering
> > the solder paste to surface mount features prior to pick and place.
> > They
> > are claiming that the boards are growing/shrinking some 15-20 mils.
> > We have done extensive measuring on unpopulated boards in-house
> > and cannot see more than 3-5 mils misregistration. The panel size
> > is approximately 14.00 x 16.00 inches, 20-24 mil pitch, and 15 BGA's
> > throughout the panel. Overall thickness .080. Is it possible that the
> > mesh
> > screen that they are using can expand/contract over time? has anyone
> > heard of this experienced this situation before. Any information would
> > be
> > greatly appreciated.
> >
> > Thanks
> > Tony Steinke
> > AIT-Atlanta

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