Bruno
As they say in the country where I used to live, "Groezi wohl" to kalt
Hamburg. Yes, I agree that outside consultancy can help and probably be
cheaper in the long run, provided that Volkmar has researched the
problem sufficiently to be able to define the terms of reference. If he
leaves this open-ended, then it will cost zillions and may not get
optimum results.
My experience as a consultant is that most clients approach me saying
that they want to change from x cleaning method to y cleaning method or
z not to clean at all, without having a clue what is involved. It
typically doubles the cost of the consultancy if they have not
previously defined at least a baseline, because the act of definition
gives them a much clearer mind and how to go about it. Another stumbling
block is that, prior to visiting the site, I'm sometimes misinformed as
to things like available equipment, end use conditions etc. which means
that my preparation is often of limited use (I minimalise preparation,
now, for that reason).
Greetings from a cold and sunny Washington DC (back to the warmth of
Cyprus by Friday!).
Brian
Volkmar Huss wrote:
>
> Hi TechNetters,
>
> we are working on defining our "No Clean" soldering process. The
> solder-paste and flux manufacturers certify the "No Clean" capability of
>
> their products to some extend, but what is the definition of "No Clean"?
>
> And I don't mean the statement, that only inert residues of flux and
> solder-paste additives remain on the board.
> Are there any standards that can used as a reference?
> How do you measure the:
> "No Clean" capability of solder paste, flux and tubular solder with flux
>
> core?
> "No Clean" quality of printed board assemblies?
> "No Clean" quality of printed board assemblies onto which devices have
> been hand-soldered?
> and all of this for prototype and series production?
>
> I have gleaned some insights from the TechNet archives, but any
> additional input is very welcome.
>
> Best regards
>
> Volkmar Hu
>
> Engineering Electronic Circuit Boards
> Aufbau- und Verbindungstechnik
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> DRGER ELECTRONICS
>
> Draeger Electronics GmbH
> Moislinger Allee 53-55
> D-23558 Lbeck
>
> Tel: +49-451-882-3998
> Fax: +49-451-882-4365
> mailto:[log in to unmask]
> Website http://www.draeger.com/de/EL
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> --
> Best regards / Mit freundlichen Gren
>
> Volkmar Hu
>
> Engineering Electronic Circuit Boards
> Aufbau- und Verbindungstechnik
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> DRGER ELECTRONICS
>
> Draeger Electronics GmbH
> Moislinger Allee 53-55
> D-23558 Lbeck
>
> Tel: +49-451-882-3998
> Fax: +49-451-882-4365
> mailto:[log in to unmask]
> Website http://www.draeger.com/de/EL
> _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
>
> M!Lj)K iuZy y<+ x!$ u{.n+zwZ,j M! T9 _Yh)m {ax `ӓ rzWR cN Tr :-zjh(Z^+ޯ* M!lzw^ r HDygzN0 N qxD x)zZʇږ[az, צj)m ǫ*\ 4r 8 zRy܆*.,)౫p r :r^q j֛jǬ f
> ܆+ް^jǯ ȭ y"m"+m_ߢٟv+bv wf '-)朅&jj+ljƤ*\(;O}M w15==
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