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March 2002

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Mar 2002 20:20:25 -0700
Content-Type:
text/plain
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text/plain (124 lines)
Brian,

Well said!!!
Particularly the qualification testing part!

David A. Douthit
Manager
LoCan LLC

Brian Ellis wrote:

> Volkmar
>
> Manufacturers of fluxes produce and sell a wide range of fluxes which
> are sold as "no-clean". Some contain rosin, others don't. Some contain
> halogenated activators, others don't. Some are very active and are
> consequently easy to solder with, but leave more dangerous residues,
> others don't, but are the devil to solder with. Some you can clean,
> others you cannot.
>
> To answer your questions: you have to select a shortlist of, say, 5
> fluxes which meet your criteria, on paper. You then do extensive trials,
> with various parameters (Taguchi is very useful for this, as you can cut
> the number of experiments drastically). After having optimised the
> process for each flux, you have to produce some test boards that you
> need to qualify as meeting your requirements for reliability under the
> conditions the boards will be used in (electrochemical migration etc.)
> and for setting up your process for quality control. As a result of
> this, you can select your #1 candidate and #2 to fall back on if there
> is an interruption of supply. No one here can do your homework for you,
> I'm afraid.
>
> Brian
>
> Volkmar Huss wrote:
> >
> > Hi TechNetters,
> >
> > we are working on defining our "No Clean" soldering process. The
> > solder-paste and flux manufacturers certify the "No Clean" capability of
> >
> > their products to some extend, but what is the definition of "No Clean"?
> >
> > And I don't mean the statement, that only inert residues of flux and
> > solder-paste additives remain on the board.
> > Are there any standards that can used as a reference?
> > How do you measure the:
> > "No Clean" capability of solder paste, flux and tubular solder with flux
> >
> > core?
> > "No Clean" quality of printed board assemblies?
> > "No Clean" quality of printed board assemblies onto which devices have
> > been hand-soldered?
> >   and all of this for prototype and series production?
> >
> > I have gleaned some insights from the TechNet archives, but any
> > additional input is very welcome.
> >
> > Best regards
> >
> >   Volkmar Huß
> >
> >   Engineering Electronic Circuit Boards
> >   Aufbau- und Verbindungstechnik
> >   _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
> >
> >   DRÄGER ELECTRONICS
> >
> >   Draeger Electronics GmbH
> >   Moislinger Allee 53-55
> >   D-23558 Lübeck
> >
> >   Tel:   +49-451-882-3998
> >   Fax: +49-451-882-4365
> >   mailto:[log in to unmask]
> >   Website http://www.draeger.com/de/EL
> >   _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
> >
> > --
> >   Best regards / Mit freundlichen Grüßen
> >
> >   Volkmar Huß
> >
> >   Engineering Electronic Circuit Boards
> >   Aufbau- und Verbindungstechnik
> >   _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
> >
> >   DRÄGER ELECTRONICS
> >
> >   Draeger Electronics GmbH
> >   Moislinger Allee 53-55
> >   D-23558 Lübeck
> >
> >   Tel:   +49-451-882-3998
> >   Fax: +49-451-882-4365
> >   mailto:[log in to unmask]
> >   Website http://www.draeger.com/de/EL
> >   _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
> >
> > Mç!*ëLj)K Ëi®?âuçZ±§ëyë ®øœy*ˆ<+¬ x!$Ò  uñÔèº{.nÇ+‰·¬zwZ™ë,j ? 2 M! TƒÂ9 ° Ø_¢YhÂ)àµìm {ax ƒ`Ó“¶ ¬1¸?rxâzWR cN T?r ?µ:-zjh?ªâ—(Z?x^?+?¯* Mç!*ëlzw^™¨¥¶‚â2Û ®ø©r àHDÓyÈgzÓN0 N ?qè¯xãD™¨¥ x)z·ZÊ?Ú?[azs,¶Ë *x|j)m ¸¬¶Ç«**\¢¸  4?r ?´8 zËRyªÜ?s?**.2s,¶)౫pà ©r à:râ*ä^2?«që jÖ?jǬ f¢”
> > Ü?+?°ù^jǯ È? ?°y»"µèm¶ŸÿÃ"¥Ê+ƒøms_ߢ»|?ÙŸ¢¶*v+b¢v¥ wè®f? ‰è?Ê'µ§-)朅&¬jj+‰«ljÆ€¢*\¢¸(¯Î;çO}ïM Æ?w15==
>
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