All,

We've lately noticed a marked increase in the number of lifted chip
resistors and castellated termination resistor packs on one of our SMT
manufacturing lines.  This began after we upped our reflow profile to solve
some solderability issues.  When we recognized this new problem, we restored
to profile to its original settings, but we're still seeing the increased
volume of "floating" components.  They're not completely tombstoned, but God
love 'em, they're trying their best to be.

Our solder prints measure as they always have, both in height and pad
coverage.

Any suggestions?

Thanks in advance,

Leland Woodall
Quality Coordinator
Keihin Carolina System Technology, Inc.
4047 McNair Road
Tarboro, NC 27886

Phone:  (252) 641-6750, Ext. 2865

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