Been down this road, and all others associated with failure modes,
mechanisms,  effects, and the analysis thereof. Sure, the possibility
exists. So do many others.

I placed a report/presentation on a ftp site some time back. It included all
the analysis I had done concerning GaAs FET amplifier failures. There are
about ten or so blank pages where the ESD failures were supposed to go.
Aganin, the pages were blank.

I had two labs do ESD (both LCD and SEM search), PIND, Acoustic Microscopy,
RGA, SEM, EDX, X-section, X-Ray, thermal, mechanical, and all other viable
tests pertaining to these devices, in accordance with MIL-STD-883E, and
found the failure mechanism to be a single PCB design issue with a little
help from just a few suspect prototype components. The component and design
issues were resolved and the assembly did as specified.

MoonMan

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