Justin,
I'm not aware of specific studies, but some manufacturers may have
reball information available. Motorola for one has a section on page 10
of AN1231 (http://e-www.motorola.com/brdata/PDFDB/docs/AN1231.pdf) that
briefly discusses their position (which is that they only recommend it
for testing of components, not for production use). Of course, they may
have a slightly biased point of view given that they may end up having
to support these packages.
In addition to the number of cycles mentioned in other posts, note that
if you have these parts on both sides of a board you add a thermal
cycle. Plus, removal of the residual solder from the device adds some
thermal stress as well, so what you may end up with is 5 or 6 cycles.
Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 x-304 voice
+1 (805) 584-1529 fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braime, Justin
Sent: Thursday, March 21, 2002 6:28 AM
To: [log in to unmask]
Subject: [TN] BGA reballing
Hi guys,
I am looking at using the SolderQuik preforms for reballing some BGAs,
but I am concerned about the reliability of this process in terms of the
number of thermal cycles being sustained by the BGA component. Does
anybody know of any studies done on this?
Thanks
Justin Braime
Senior Production Engineer
Racal Instruments Ltd
480 Bath Rd, Slough
Berkshire, SL1 6BE
England
Tel: +44 (0)1628 604455
Fax: +44 (0)1628 662017
E-mail: [log in to unmask]
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