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Subject:	BGA reballing
From:	"Braime, Justin" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 21 Mar 2002 14:27:48 -0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (40 lines)

Hi guys,
I am looking at using the SolderQuik preforms for reballing some BGAs, but I
am concerned about the reliability of this process in terms of the number of
thermal cycles being sustained by the BGA component. Does anybody know of
any studies done on this?

Thanks

Justin Braime
Senior Production Engineer

Racal Instruments Ltd
480 Bath Rd, Slough
Berkshire, SL1 6BE
England

Tel: +44 (0)1628 604455
Fax: +44 (0)1628 662017
E-mail: [log in to unmask]




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