TechNetters,
I have a two fine fellows who work for me who come from different
backgrounds.  With regards to cross-sectioning solder joints, one is used to
providing his customers with a metallurgical description of the metal in the
joint.  He says it is important to describe the number and size of tin and
lead dendrites, grain size, lamellar or otherwise general structure, etc.
The other says this is not necessary.  Both of course agree on fillet size,
shape, cracks, voids, presence/absence/thickness of intermetallic.

Now I agree that grain size is not going to give you much, since solid room
temperature solder is close enough to its melting point that the grain size
will change within a few months anyways.  But what about the rest?

regards,
Bev Christian
Research in Motion

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