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March 2002

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Mar 2002 14:07:14 -0500
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text/plain (72 lines)
Siggi,

I know that TI generated a BGA Solderability Test method, based on the
technique described in EIA/JESD22-B102C, Solderability Test Method. They
used a reflow soldering oven to perform the test and a blank ceramic card.
You can get a description of the test method from TI's website.

I tried it with a SMT rework station, using a glass slide. I found that you
could achieve the same type of results with the rework station as with the
reflow oven and ceramic card.

Give me a call off line some time. Hope this helps.

Good Luck.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Zweigart, Siegmund
> Sent: Thursday, March 14, 2002 4:03 AM
> To: [log in to unmask]
> Subject: [TN] Solderability of BGA
>
>
> Hello
>
> I am looking for some documents about solderability tests for BGA s with
> eutectik balls. Can anybody help me in this subject?
> We think that the BGA- Balls were touched by fingers and the
> solderiability
> is significant reduced.
> How can we analyse the component for fingerprints? We are thinking of
> looking for NaCl.
> Has anybody another idea?
>
> Siggi
>
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