Hi, Lou,

The 10 & 12 layer boards I currently work with are FR4/26 Tg 170 stuff and
we specify 2 oz copper plane layers and 1 oz signal layers. Although we
also illustrate the stack-up as copper-core-copper prepreg
copper-core-copper, I believe our fab shop laminates copper foil to achieve
the end result.

Having said that, just because your fab shop doesn't stock it doesn't
necessarily make it non-standard material. Did your previous fab shop
comment on having the same problem, or did they have stock, or did they do
foil lamination?

Peter




                    "Takach, Lou
                    J"                   To:     [log in to unmask]
                    <ljtakach@SWI        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    TCH.COM>             Aero/ST Group)
                    Sent by:             Subject:     [TN] Non-Standard material
                    TechNet
                    <[log in to unmask]
                    ORG>


                    03/18/02
                    08:11 PM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
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                    "Takach, Lou
                    J"






Good Morning Technetters...

I need your input / advice. Our manufacturing facility has recently (within
a year or so...) switched to a new PCB fabricator. I'm now starting to get
complaints from manufacturing that our fabricator is having trouble
obtaining the 'non-standard' material that we are specifying.  First of
all,
I don't believe that I'm specifying non-standard material, this is where I
need your input. Most of our boards are multi-layer, usually 4 to 6 layers
and we use FR4. We typically specify 2-oz copper on the internal power and
ground layers and sometimes 1-oz copper for the outer signal layers. Is
this
non-standard? The fabricator says that they typically don't stock 1 over 2
copper. Maybe I'm missing something but I thought that the stackup could be
made of individual copper sheets of various copper weights as long as the
layer sequence was balanced.

All comments welcome...

Lou

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