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March 2002

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Date:
Tue, 19 Mar 2002 08:08:24 +0800
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Late input here. Look at your boards as being incremental elements of the
entire panel. The bow and twist on one board is proably very small, which,
if you were processing individual boards, would not matter. The actual
positional displacement of component locations would be tiny. However, on a
large panel where the displacement has been compounded many times, the
displacement (b/t) becomes significant. Hence the reason why panelled
boards shall be considered as panels and not as individual boards.

Peter




                    "Marsico, James"
                    <James.Marsico@D        To:     [log in to unmask]
                    P.AIL.COM>              cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by: TechNet        Aero/ST Group)
                    <[log in to unmask]        Subject:     Re: [TN] Board Bow and Twist
                    >


                    03/14/02 09:29
                    PM
                    Please respond
                    to "TechNet
                    E-Mail Forum.";
                    Please respond
                    to "Marsico,
                    James"






I look at it from a different perspective, reliability.  If you populate
(and reflow) warped boards, what happens to the solder joints when the
boards are flattened when installed in the next higher assembly?  Now that
I
think about it, probably nothing, since the solder will eventually relax.
Right?  But why else would there be a more stringent flatness requirement
for SMT boards than TH since most P&P systems hold SMT boards down by the
edges?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Franklin D Asbell [SMTP:[log in to unmask]]
        Sent:   Thursday, March 14, 2002 8:25 AM
        To:     TechNet E-Mail Forum.; Marsico, James
        Subject:        Re:      [TN] Board Bow and Twist

        James,

        An afterthought, the bow and twist requirement is there to provide
ease of
        board population as well as end use fit. If the board is warped
prior to
        assembly, this indeed would affect population thus potentially
making the
        boards unsuitable for end use...just something to think about, or
pass along
        to your supplier.

        Franklin

        ----- Original Message -----
        From: "Marsico, James" <[log in to unmask]>
        To: <[log in to unmask]>
        Sent: Thursday, March 14, 2002 6:48 AM
        Subject: [TN] Board Bow and Twist


        > I think this is a no-brainer, but here goes...  We were delivered
boards
        in
        > panel form from one of our suppliers.  At Incoming Inspection,
the
panel
        was
        > rejected for excessive bow (>75% for SMT) and returned the
supplier.  The
        > supplier called me and said that even though the panel exceeded
the bow
        > requirement, the individual boards were acceptable.  When I
quoted
the bow
        > and twist requirement from IPC-6012, "Panels which contain
multiple
        printed
        > boards which are assembled on the panel and later separated shall
be
        > assessed in panel form." , he said yes, you measure the
individual
boards
        in
        > the panel.  I need clarification.
        > Thanks,
        > Jim Marsico
        > Senior Engineer
        > Production Engineering
        > EDO Electronics Systems Group
        > [log in to unmask] <mailto:[log in to unmask]>
        > 631-595-5879
        >
        >
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