Mark Ross wrote:

> Can anyone recommend a book or technical articles on thermal profiling of
> assemblies in reflow ovens?  There seems to be a difference of opinion on
> the correct way to do it.

> Mark,

You might also take a look at IPC-7530, "Guidelines for Temperature Profiling for Mass Soldering
Processes (Reflow and Wave)".  I'm sure you can get it through the IPC bookstore.

--
Brian McCrory

Delsen Testing Laboratories, Inc.
1024 Grand Central Ave.
Glendale, CA  91201

Phone:  (818) 247-4106
FAX:    (818) 247-4537
email:  [log in to unmask]

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