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March 2002

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Subject:
From:
Phil Kinner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Mar 2002 17:38:00 -0000
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Mark,

The National Physical Laboratory here in the UK did a studio project on
just this very topic.  I believe you can download their recommendations
at www.npl.co.uk/ei

Phil Kinner
Chief Chemist
Concoat Ltd
2C Albany Park, Frimley Road,
Camberley, Surrey, GU16 7PH

Tel: +44 (0) 1276 691100
Fax: +44 (0) 1276 691227


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Ross
Sent: 18 March 2002 16:16
To: [log in to unmask]
Subject: [TN] Books/articles on thermal profiling

Can anyone recommend a book or technical articles on thermal profiling
of
assemblies in reflow ovens?  There seems to be a difference of opinion
on
the correct way to do it.  I have heard:

"Use high temperature solder and solder the thermocouple to the part
(great
if it isn't a 0402 or worse an 0201!)"

"Don't use high temperature solder, it will alter the thermal mass of
the
device.  Use a high temperature epoxy that is thermally conductive and
glue
the probe to the device".

"Don't use epoxy, it changes the thermal mass of the device, use a
temperature thin metal tape that has a strong high temperature
adhesive".


Also when it comes to keeping the parts on the board, I was all for a
board
being conformal coated to keep the parts from moving, scraping back of
the
coating where I needed to take my readings and then run the board
through.
I have been told that conformal alters the thermal mass of the product.

And on and on....

Last time I asked for suggestions on soldering books, I was pointed to
one
By Jennie Hwang and that worked out great so I am hoping there are some
books or articles and maybe even an IPC spec on how to do this so that I
can
ensure we are profiling the boards correctly.  Thanks for all input.



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