Can anyone recommend a book or technical articles on thermal profiling of
assemblies in reflow ovens?  There seems to be a difference of opinion on
the correct way to do it.  I have heard:

"Use high temperature solder and solder the thermocouple to the part (great
if it isn't a 0402 or worse an 0201!)"

"Don't use high temperature solder, it will alter the thermal mass of the
device.  Use a high temperature epoxy that is thermally conductive and glue
the probe to the device".

"Don't use epoxy, it changes the thermal mass of the device, use a
temperature thin metal tape that has a strong high temperature adhesive".


Also when it comes to keeping the parts on the board, I was all for a board
being conformal coated to keep the parts from moving, scraping back of the
coating where I needed to take my readings and then run the board through.
I have been told that conformal alters the thermal mass of the product.

And on and on....

Last time I asked for suggestions on soldering books, I was pointed to one
By Jennie Hwang and that worked out great so I am hoping there are some
books or articles and maybe even an IPC spec on how to do this so that I can
ensure we are profiling the boards correctly.  Thanks for all input.



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