Hello Technetters,

We're having a little trouble interpreting the HDI spec, IPC-6016,
paragraph 3.6.1, "Thermal Stress Method".  This paragraph tells us to test
per IPC-TM-650, method 2.6.8 condition B and "the number of cycles shall be
five (unless limited by the number of stress cycles acceptable for the core
board) or as specified on the appropriate slash sheet."  Does this mean we
are to float the test coupon on the solder pot five times??  The TM doesn't
say anything about more than one dip in the solder pot?  Five, 10 second
floats on 260C solder seems a bit harsh and un-realistic.  What am I missing?

Best regards,
Gregg Klawson
General Dynamics C4 Systems
Taunton, Massachusetts, USA
mailto:[log in to unmask]

The views expressed are the author's and do not necessarily reflect the
official position of General Dynamics or any of its subsidiaries.

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