GANG,

Like I said, give me a call DIRECTLY, offline so that I do not offend the
TechNet community.

Give me the following information (for ACI's records) and I'll get a CD-ROM
made up for you.

Name
Title
Company Name
Address (Shipping since I plan to Airborne Express it to you.)
Telephone Number
FAX Number
E-Mail

Give me a couple of days but you'll get it.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Dave Hillman
> Sent: Thursday, March 14, 2002 10:11 AM
> To: [log in to unmask]
> Subject: Re: [TN] High Rel BGA Guidelines
>
>
> Hi Bob! I recommend you contact Lee Whiteman at ACI/EMPF ("Lee Whiteman"
> <[log in to unmask]>) to look at the EMMA program Technical Assessment
> Guidelines (TAG). The TAG documents a 2 year NavyMantech program in which
> ACI/Rockwell Collins/Crane/Raytheon looked at 21 types of area array
> components on a variety of board laminate and surface finishes under
> vibration, thermal cycling, and bias humidity testing conditions. Good
> Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>
> "Crain, Bob" <[log in to unmask]>@ipc.org> on 03/13/2002 03:44:28 PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>;
> Please respond
>        to "Crain, Bob" <[log in to unmask]>
>
> Sent by:    TechNet <[log in to unmask]>
>
>
> To:    [log in to unmask]
> cc:
>
> Subject:    [TN] High Rel BGA Guidelines
>
>
> We may soon be adding BGAs to our approved parts list for some
> programs. We
> use polyamide boards and require electrical test under vibration and
> thermal
> cycling. What are the most important factors to address to maximize our
> success?
>
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
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