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March 2002

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Subject:
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Mar 2002 09:23:09 -0600
Content-Type:
text/plain
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text/plain (70 lines)
Hi Siggi! A number of folks are using the JSTD-002A Component Solderability
specification - test method S "Surface Mount Process Simulation" test. The
test methodology is to stencil a solderpaste footprint pattern onto a
nonwettable surface, place the BGA onto the footprint pattern, reflow,
clean and inspect. The BGA eutectic solderspheres and the solderpaste
should melt together to form coherent spheres - if you have a solderability
problem (e.g. contamination, oxidation) you would see wetting problems.
Good Luck.

Dave Hillman
JSTD002A Chairman
[log in to unmask]




"Zweigart, Siegmund" <[log in to unmask]>@ipc.org> on 03/14/2002
03:03:07 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
       to "Zweigart, Siegmund" <[log in to unmask]>

Sent by:    TechNet <[log in to unmask]>


To:    [log in to unmask]
cc:

Subject:    [TN] Solderability of BGA


Hello

I am looking for some documents about solderability tests for BGA s with
eutectik balls. Can anybody help me in this subject?
We think that the BGA- Balls were touched by fingers and the solderiability
is significant reduced.
How can we analyse the component for fingerprints? We are thinking of
looking for NaCl.
Has anybody another idea?

Siggi

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