Bob,

The recently completed EMMA (Electronic Miniaturization for Missile
Application) Program documented the performance of specific Leaded Surface
Mount, BGA, Flip Chip, and CSP electronic packages for vibration and thermal
reliability, on different board materials (FR4, Thermount, Polyimide) and
board finishes (OSP, ENIG).

If you (or anyone else) wishes information on the program and its results,
please contact me DIRECTLY (not through the TechNet Forum - I don't want to
offend the TechNet community).

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Crain, Bob
> Sent: Wednesday, March 13, 2002 4:44 PM
> To: [log in to unmask]
> Subject: [TN] High Rel BGA Guidelines
>
>
> We may soon be adding BGAs to our approved parts list for some
> programs. We
> use polyamide boards and require electrical test under vibration
> and thermal
> cycling. What are the most important factors to address to maximize our
> success?
>
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> ---------------
>

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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
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