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March 2002

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Subject:
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Mar 2002 09:10:47 -0600
Content-Type:
text/plain
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text/plain (63 lines)
Hi Bob! I recommend you contact Lee Whiteman at ACI/EMPF ("Lee Whiteman"
<[log in to unmask]>) to look at the EMMA program Technical Assessment
Guidelines (TAG). The TAG documents a 2 year NavyMantech program in which
ACI/Rockwell Collins/Crane/Raytheon looked at 21 types of area array
components on a variety of board laminate and surface finishes under
vibration, thermal cycling, and bias humidity testing conditions. Good
Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





"Crain, Bob" <[log in to unmask]>@ipc.org> on 03/13/2002 03:44:28 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
       to "Crain, Bob" <[log in to unmask]>

Sent by:    TechNet <[log in to unmask]>


To:    [log in to unmask]
cc:

Subject:    [TN] High Rel BGA Guidelines


We may soon be adding BGAs to our approved parts list for some programs. We
use polyamide boards and require electrical test under vibration and
thermal
cycling. What are the most important factors to address to maximize our
success?

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